Silk-Encapsulated Plasmonic Biochips with Enhanced Thermal Stability
نویسندگان
چکیده
منابع مشابه
Enhanced thermal stability of eugenol by cyclodextrin inclusion complex encapsulated in electrospun polymeric nanofibers.
Polyvinyl alcohol (PVA) nanofibers encapsulating eugenol (EG)/cyclodextrin (CD) inclusion complexes (IC) (EG/CD-IC) were produced via electrospinning technique in order to achieve high thermal stability and slow release of EG. In order to find out the most favorable CD type for the stabilization of EG, three types of native cyclodextrins (α-CD, β-CD, and γ-CD) were used for the formation of EG/...
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ژورنال
عنوان ژورنال: ACS Applied Materials & Interfaces
سال: 2016
ISSN: 1944-8244,1944-8252
DOI: 10.1021/acsami.6b07362